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TI公司的AM5749是高性別能Sitara ARM應(yīng)用處理器，具有帶Neon擴(kuò)展的雙核ARM Cortex-A15 RISC CPU和兩個(gè)TIC66x VLIW浮點(diǎn)DSP核，集成了多達(dá)2.5MB L3 RAM，兩個(gè)DDR3/DDR3L存儲(chǔ)器接口（EMIF）模塊，支持速率到DDR3-1333，多達(dá)2GB/EMIF，支持ECC/EMIF，主要用在工業(yè)通信，人機(jī)接口（HMI），自動(dòng)化和控制，高性能應(yīng)用以及其它通用應(yīng)用。本文介紹了AM5749主要特性，框圖，DDR3接口電路以及評(píng)估模塊AM574x IDK框圖，電路圖，材料清單和PCB設(shè)計(jì)圖。
AM574x Sitara Arm applications processors are built to meet the intense processing needs of modernembedded products.
AM574x devices bring high processing performance through the maximum flexibility of a fully integratedmixed processor solution. The devices also combine programmable video processing with a highlyintegrated peripheral set. Cryptographic acceleration is available in every AM574x device.
Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon? extension， and two TIC66x VLIW floating-point DSP cores. The Arm allows developers to keep control functions separate fromother algorithms programmed on the DSPs and coprocessors， thus reducing the complexity of the systemsoftware.
Additionally， TI provides a complete set of development tools for the Arm and C66x DSP， including Ccompilers， a DSP assembly optimizer to simplify programming and scheduling， and a debugging interfacefor visibility into source code execution.
Cryptographic acceleration is available in all devices. All other supported security features， includingsupport for secure boot， debug security and support for trusted execution environment are available onHigh-Security （HS） devices. For more information about HS devices， contact your TI representative.
AM5749主要特性：
? Dual Arm? Cortex?-A15 MicroprocessorSubsystem
? Up to two C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x andC64x+
– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle
? Up to 2.5MB of On-Chip L3 RAM
? Two DDR3/DDR3L Memory Interface （EMIF）Modules
– Supports rates up to DDR3-1333
– Up to 2GB Supported per EMIF
– ECC supported on primary EMIF
? 2× Dual Arm? Cortex?-M4 co-processors （IPU1and IPU2）
? Up to Two Embedded Vision Engines （EVEs）
? IVA-HD Subsystem
– 4K @ 15fps encode and decode support forH.264 CODEC
– Other CODECs are up to 1080p60
? Display Subsystem
– Full-HD Video （1920×1080p， 60 fps）
– Multiple Video Input and Video Output
– 2D and 3D Graphics
– Display Controller With DMA Engine and up toThree Pipelines
– HDMI? Encoder： HDMI 1.4a and DVI 1.0Compliant
? 2× Dual-Core Programmable Real-Time Unit andIndustrial Communication Subsystem （PRU-ICSS）
? 2D-Graphics Accelerator （BB2D） Subsystem
– Vivante? GC320 Core
? Video Processing Engine （VPE）
? Dual-Core PowerVR? SGX544 3D GPU
? Secure Boot support
– Hardware-enforced Root-of-trust
– Customer programmable keys and OTP data
– Support for Takeover protection， IP protection，and anti-roll back protection
? Cryptographic Acceleration support
– Supports cryptographic cores
– AES – 128/192/256-bits key sizes
– 3DES – 56/112/168-bits key sizes
– MD5， SHA1
– SHA2 – 224/256/384/512
– True Random number generator
– DMA support
? Debug security
– Secure software controlled debug access
– Security aware debugging
? Trusted Execution Environment （TEE） support
– Arm TrustZone based TEE
– Extensive Firewall support for isolation
– Secure DMA path and interconnect
– Secure watchdog/timer/IPC
? Two Video Input Port （VIP） Modules
– Support for up to eight Multiplexed Input Ports
? General-Purpose Memory Controller （GPMC）
? Enhanced Direct Memory Access （EDMA）Controller
? 2-Port Gigabit Ethernet （GMAC）
? Sixteen 32-Bit General-Purpose Timers
? 32-Bit MPU Watchdog Timer
? Five Inter-Integrated Circuit （I2C） Ports
? HDQ?/ 1-Wire ? Interface
? Ten Configurable UART/IrDA/CIR Modules
? Four Multichannel Serial Peripheral Interfaces（McSPI）
? Quad SPI Interface （QSPI）
? SATA Gen2 Interface
? Eight Multichannel Audio Serial Port （McASP）Modules
? SuperSpeed USB 3.0 Dual-Role Device
? High-Speed USB 2.0 Dual-Role Device
? Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces （ MMC?/ SD?/SDIO）
? PCI Express? 3.0 Subsystems With Two 5-GbpsLanes
– One 2-lane Gen2-Compliant Port
– or Two 1-lane Gen2-Compliant Ports
? Up to two Controller Area Network （DCAN）Modules
– CAN 2.0B Protocol
? Modular Controller Area Network （MCAN） Module
– CAN 2.0B Protocol with available FD（Flexible Data Rate） functionality
? Up to 247 General-Purpose I/O （GPIO） Pins
? Power， Reset， and Clock Management
? On-Chip Debug With CTools Technology
? 28-nm CMOS Technology
? 23 mm × 23 mm， 0.8-mm Pitch， 760-Pin BGA（ABZ）
AM5749應(yīng)用：
? Industrial Communication
? Human Machine Interface （HMI）
? Automation and Control
? High Performance Applications
? Other General Use
圖1.AM5749框圖
圖2.采用兩個(gè)16位DDR3器件32位一組DDR3接口電路圖
圖3.采用四個(gè)8位DDR3器件32位一組DDR3接口電路圖
評(píng)估模塊AM574x IDK
AM574x Industrial Development Kit （IDK） Evaluation Module （EVM）
The AM574x IDK is a standalone test， development， and evaluation module that enables developers towrite software and develop hardware for industrial control and industrial communications applications. Ithas been equipped with a TI AM5748 processor and a defined set of features to allow you to experienceindustrial communication solutions using various serial or Ethernet based interfaces. Using standardinterfaces， the AM574x IDK may interface to other processors or systems and act as a communicationgateway or controller. In addition， it can directly operate as a standard remote I/O system or a sensor connected to an industrial communication network.
The AM574x IDK contains embedded emulation circuitry to quickly enable developers to begin using thisIDK. The embedded emulation logic allows emulation and debug using standard development tools suchas the Texas Instruments Code Composer Studio? integrated development environment （IDE） by simplyconnecting a USB cable to a Windows?-based computer.
The standard configuration for the AM574x IDK EVM provides the following Ethernet connectivity：
? Two Gigabit （1000Mb） metallic ports connected via PHY/RGMII to the on-chip Ethernet switch
? Two 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Reconfiguration through resistor removal and installation can provide an alternate Ethernet connectivity：
? Four 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Software support for the AM574x IDK EVM is provided within the Processor Software Development Kit（SDK） package. This includes both Linux and RTOS support.
圖4.評(píng)估模塊AM574x IDK外形圖
圖5.評(píng)估模塊AM574x IDK外形圖（背面）
圖6.評(píng)估模塊AM574x IDK框圖
圖7.評(píng)估模塊AM574x IDK電路圖（1）
圖8.評(píng)估模塊AM574x IDK電路圖（2）
圖9.評(píng)估模塊AM574x IDK電路圖（3）
圖10.評(píng)估模塊AM574x IDK電路圖（4）
圖11.評(píng)估模塊AM574x IDK電路圖（5）
圖12.評(píng)估模塊AM574x IDK電路圖（6）
圖13.評(píng)估模塊AM574x IDK電路圖（7）
圖14.評(píng)估模塊AM574x IDK電路圖（8）
圖15.評(píng)估模塊AM574x IDK電路圖（9）
圖16.評(píng)估模塊AM574x IDK電路圖（10）
圖17.評(píng)估模塊AM574x IDK電路圖（11）
圖18.評(píng)估模塊AM574x IDK電路圖（12）
圖19.評(píng)估模塊AM574x IDK電路圖（13）
圖20.評(píng)估模塊AM574x IDK電路圖（14）
圖21.評(píng)估模塊AM574x IDK電路圖（15）
圖22.評(píng)估模塊AM574x IDK電路圖（16）
圖23.評(píng)估模塊AM574x IDK電路圖（17）
圖24.評(píng)估模塊AM574x IDK電路圖（18）
圖25.評(píng)估模塊AM574x IDK電路圖（19）
圖26.評(píng)估模塊AM574x IDK電路圖（20）
圖27.評(píng)估模塊AM574x IDK電路圖（21）
圖28.評(píng)估模塊AM574x IDK電路圖（22）
圖29.評(píng)估模塊AM574x IDK電路圖（23）
圖30.評(píng)估模塊AM574x IDK電路圖（24）
圖31.評(píng)估模塊AM574x IDK電路圖（25）
圖32.評(píng)估模塊AM574x IDK電路圖（26）
圖33.評(píng)估模塊AM574x IDK電路圖（27）
圖34.評(píng)估模塊AM574x IDK電路圖（28）
圖35.評(píng)估模塊AM574x IDK電路圖（29）
圖36.評(píng)估模塊AM574x IDK電路圖（30）
圖37.評(píng)估模塊AM574x IDK電路圖（31）
圖38.評(píng)估模塊AM574x IDK電路圖（32）
評(píng)估模塊AM574x IDK材料清單：
圖39.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（1）
圖40.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（2）
圖41.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（3）
圖42.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（4）
圖43.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（5）
圖44.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（6）
圖45.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（7）
圖46.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（8）
圖47.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（9）
圖48.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（10）
圖49.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（11）
圖50.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（12）
圖51.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（13）
圖52.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（14）
圖53.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（15）
圖54.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（16）
圖55.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（17）
圖56.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（18）
圖57.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（19）
圖58.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（20）
圖59.評(píng)估模塊AM574x IDK PCB設(shè)計(jì)圖（21）
詳情請(qǐng)見：
和
am5749.pdf
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