在物聯(lián)網(wǎng)電路板設計中實現(xiàn)最佳無線通信性能

　　技術創(chuàng)新是加快和物聯(lián)網(wǎng)（IoT）吸收發(fā)展，至少不是“片上系統(tǒng)”（SOC）設計，結(jié)合微控制器（MCU）和無線連接?，F(xiàn)代SoC授權設計師提供高性能網(wǎng)絡和獲得新的制度設計，市場比以往任何時候都更快、更便宜地。

　　產(chǎn)品設計者必須最大限度地提高無線通信性能-無論他們使用的協(xié)議-確保他們的射頻（RF）電路和電路板布局進行了全面優(yōu)化。

　　This is no easy task， because the RF signals you want to send and receive probably won’t be the only ones present： switching power supplies or the MCU clock， for example， can also generate RF signals. Bad design can hamper the device’s communication range， or require higher-power transmission to compensate. In battery-powered devices， the second option has the undesired effect of shortening battery life. Moreover， transmitting at higher power may create false signals， which can interfere with other devices or fall foul of regulatory requirements.

　　This is why product makers need to understand some key enablers of good wireless communication， as well as the way their circuit layouts can affect these enablers. This article will look at some best practices that will help designers deliver optimal RF performance from their products. Throughout the piece， we’ll make reference to a circuit board layout to house the EFR32 Wireless Gecko SoC from Silicon Labs.