DDR5 DIMM BLACK HSG AND NATRUAL
TE Connectivity (Tyco Electronics)
工作溫度范圍:-;本體最大高度:-;觸頭鍍層:-;連接器類型:卡座;卡類型:-;焊接溫度(最大值):-;觸頭材質(zhì):-;卡連接方式:翻蓋式;
Molex
DDR5 DIMM BLACK HSG AND BLACK LA
TE Connectivity (Tyco Electronics)
CONN CARD PUSH-PULL EDGE MNT
Samtec
邊緣板連接器 非指定 - 單邊 母頭 30 0.031"(0.79mm) 1 0.039"(1.00mm) 單路 板導(dǎo)軌,卡導(dǎo)軌
Samtec
.050" FLEX CARD TERMINAL
Samtec
CONN SMART CARD PUSH-PULL R/A
Amphenol
CONN MICRO SD CARD PUSH-PUSH R/A
Molex
72 Position SIMM RAM Socket Through Hole
Molex
CONN SIM CARD HINGED TYPE R/A
Molex