適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):24P;行距:7.62mm;觸頭鍍層:錫;
Ckmtw
IC socket spacing 2.54mm 14Pin line spacing 7.62mm straight round hole
NEXTRON Components
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):14;行距:7.62mm;觸頭鍍層:-;
BOOMELE
8058-39G3=To5 Socket 200 Circ
TE Connectivity (Tyco Electronics)
2.54mm 圓孔排母,單排,180度,塑高7.0mm,D3.0mm,L=10.0mm,PPS料,內(nèi)金外錫,03P
XKB
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):16;行距:7.62mm;觸頭鍍層:錫;
Ckmtw
適用IC封裝類型:DIP;間距:2.54mm;總針腳數(shù):28P;行距:7.62mm;觸頭鍍層:錫;
Ckmtw
DIP Circular Holes -40℃~+105℃ 7.62mm 8 2.54mm DIP-8 IC Sockets ROHS
XFCN
IC socket spacing 2.54mm 18Pin line spacing 7.62mm straight round hole
NEXTRON Components
IC socket spacing 2.54mm 40Pin line spacing 15.24mm straight plug
BOOMELE